Job description

Senior Packaging Engineer

Irvine, California


OVERVIEW

We are looking for a Senior Packaging Engineer to be part of a fabless semiconductor company focused on developing innovative Analog and RF components necessary for simplifying the design of next generation True5G wireless products. With antennas, beamformers, and other Analog/RF ICs, our client is driving to become the premier supplier for 5G, True5GTM millimetre wave, and all future wireless devices.

KEY RESPONSIBILITIES AND ACTIVITIES INCLUDE

• Create and manage package documentation including fabrication and assembly packages.
• Good understanding of package construction
• Interface with substrate manufacturing vendors to use vendor-approved design rules for physical design
• Understanding of assembly process and manufacturing of semiconductor packages
• Ability to work and communicate effectively in a multi-functional team
• Proven track record to design and manage all aspects of the RFIC package used in high volume production

EDUCATION AND EXPERIENCE REQUIREMENTS

• Bachelor’s degree in Electrical Engineering or related discipline
• At least 3+ years of relevant industry experience in physical design of multi-layer package substrates
• Understanding of assembly process and manufacturing of semiconductor package
• Hands on experience with Cadence Allegro (APD) or SIP for physical design
• Create and manage package documentation including fabrication and assembly packages, such as (Gerber, ODB, fab and assembly drawing)
• Good understanding of package construction and stack up for (FCCSP, FCBGA, LGA, QF)
• Interface with substrate manufacturing vendors to use vendor-approved design rules for physical design

For your opportunity to advance, kindly send your cv at [email protected] or [email protected]